Staff R&D Product Engineer - Liquid Cooling & Cage Systems

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.

• Lead the design and development of high-speed interconnect cage systems and liquid cooling products from concept through production release.
• Translate customer, system, thermal, reliability, and manufacturing requirements into robust product architectures and design solutions.
• Develop innovative products for AI servers, networking equipment, high-performance computing (HPC), and hyperscale data center applications.
• Create and optimize 3D designs, engineering drawings, specifications, and Bills of Materials (BOMs) using CAD tools.
• Lead the development of HSIO cage platforms including OSFP, OSFP-XD, QSFP-DD, QSFP112, and future-generation interconnect solutions.
• Design and optimize EMI shielding structures, module latching mechanisms, alignment features, retention systems, and thermal attachment solutions.
• Develop liquid cooling solutions including cold plates, manifolds, fluid distribution systems, blind mate fluid connectors, and quick disconnect couplings.
• Perform mechanical design analysis including GD&T, tolerance stack-up analysis, design optimization, and manufacturability assessments.
• Collaborate with thermal simulation, quality, manufacturing, tooling, supplier engineering, and product management teams throughout the product lifecycle.
• Lead DFM, DFA, APQP, NPI, and industrialization activities to ensure scalable and cost-effective manufacturing solutions.
• Drive product validation, qualification testing, reliability analysis, and root cause investigations.
• Develop and execute DVP&R plans, DFMEA reviews, and product qualification strategies.
• Support customer design reviews and resolve technical issues related to mechanical, thermal, manufacturing, and reliability performance.
• Manage engineering changes, product improvements, and continuous improvement initiatives throughout the product lifecycle.
• Participate in LEANPD stage-gate processes to ensure projects meet cost, quality, schedule, and performance objectives.
• Provide technical leadership across global engineering teams and serve as a key customer-facing technical resource.

• Bachelor's degree or higher in Mechanical Engineering, Thermal Engineering, Manufacturing Engineering, Electrical Engineering, Materials Engineering, or a related engineering discipline.
• Master's degree preferred.
• Minimum of 14 years of experience in product development involving high-speed interconnects, connector systems, cage products, thermal management, or liquid cooling solutions.
• Proven track record of leading products from concept development through qualification, manufacturing launch, and lifecycle management.
• Experience working directly with customers and cross-functional global engineering teams.
• Background in Design for Manufacturing (DFM), New Product Introduction (NPI), process validation, and product qualification.
• Experience supporting customer-facing engineering activities and complex technical problem-solving.
• Experience with AI servers, data center infrastructure, networking equipment, or high-performance computing platforms preferred.

• Strong knowledge of mechanical product design and development, including:

• Product architecture development
• Tolerance analysis
• GD&T
• DFMEA
• Product validation and qualification
• Reliability engineering

• Proficiency with 3D CAD design tools such asCreo or SolidWorks.
• Strong understanding of mechanical design principles, engineering analysis, and statistical design methodologies.
• Experience designing and developing products using:

• Metal stamping
• Sheet metal fabrication
• Machining
• Welding
• Brazing
• Molding
• Plating
• Automated assembly

• Knowledge of HSIO technologies and industry standards including:

• OSFP
• OSFP-XD
• QSFP-DD
• QSFP112

• Knowledge of liquid cooling technologies including:

• Cold plates
• Direct-to-chip cooling
• Manifolds
• Fluid distribution systems
• Quick Disconnect Couplings (QDC)
• Rack-level cooling solutions

• Experience developing and maintaining engineering documentation, specifications, and product requirements.
• Strong analytical, troubleshooting, and root cause investigation skills.
• Excellent written and verbal communication skills.
• Ability to collaborate effectively across global teams and multiple time zones.

• Experience supporting hyperscale data center, cloud computing, AI infrastructure, and networking applications.
• Knowledge of thermal management technologies, CFD analysis, and thermal-fluid optimization techniques.
• Experience with quality and reliability methodologies including:

• FMEA
• Six Sigma
• DOE
• 8D Problem Solving
• APQP

• Experience working with OCP systems, NVIDIA HGX/NVL platforms, and AI accelerator environments.
• Strong customer-facing communication and presentation skills.
• Ability to communicate complex technical concepts to customers, leadership, and cross-functional teams.
• Experience leading global engineering projects and influencing cross-functional teams.
• Knowledge of intellectual property development, technical publications, and patent submissions.
• Proficiency with Microsoft Office applications including Word, Excel, PowerPoint, Outlook, and Teams.

• Competitive base salary commensurate with experience: $145,300 - $217,900 (subject to change dependent on physical location)
• Posted salary ranges are made in good faith. TE Connectivity reserves the right to adjust ranges depending on the experience/qualification of the selected candidate as well as internal and external equity.
• Total Compensation = Base Salary + Incentive(s) + Benefits

• A comprehensive benefits package including health insurance, 401(k), disability, life insurance, employee stock purchase plan, paid time off and voluntary benefits.

EOE, Including Disability/VetsIMPORTANT NOTICE REGARDING RECRUITMENT FRAUD TE Connectivity has become aware of fraudulent recruitment activities being conducted by individuals or organizations falsely claiming to represent TE Connectivity. Please be advised that TE Connectivity never requests payment or fees from job applicants at any stage of the recruitment process. All legitimate job openings are posted exclusively on our official careers website at and all email communications from our recruitment team will come only from actual email addresses ending in @te.com. If you receive any suspicious communications, we strongly advise you not to engage or provide any personal information, and to report the incident to your local authorities.

• Position supports a global customer base and requires collaboration across engineering, manufacturing, supplier, and customer teams worldwide.
• Occasional flexibility in working hours may be required to support customers and teams across multiple regions and time zones.
• The role combines advanced product design, liquid cooling technology development, customer engagement, manufacturing support, and technical leadership throughout the product lifecycle.
• Experience with AI servers, hyperscale data centers, high-speed connectivity solutions, thermal management systems, and liquid cooling infrastructure is highly desirable.
• The successful candidate will play a key role in developing next-generation connectivity and cooling solutions that enable the future of AI, networking, and cloud computing platforms.

At TE Connectivity, we help build the technologies that keep the world connected. As a global leader in connectivity and sensor solutions, we partner with customers across industries to develop innovative products that power transportation, industrial, medical, energy, aerospace, and data infrastructure applications.

The Digital Data Networks department is seeking an experienced Staff R&D Product Engineerto lead the development of next-generation high-speed interconnect and thermal management solutions for AI servers, networking equipment, and hyperscale data center applications. This role is responsible for driving product development from concept through production launch, transforming customer and system requirements into innovative, reliable, and manufacturable products. The engineer will work closely with customers, product management, manufacturing, thermal engineering, and cross-functional teams to develop advanced cage systems, liquid cooling solutions, and high-performance connectivity products that support the rapidly growing AI infrastructure market.

TE Connectivity plc (NYSE: TEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. As a trusted innovation partner, our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers enabling artificial intelligence, and more.

Our more than 90,000 employees, including 10,000 engineers, work alongside customers in approximately 130 countries. In a world that is racing ahead, TE ensures that EVERY CONNECTION COUNTS. Learn more at and on LinkedIn, Facebook, WeChat, Instagram and X (formerly Twitter).